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SAC Solder Paste
December 31, 1969 |Estimated reading time: Less than a minute
SAC3 XM5S is formulated with a synthetic base to withstand higher lead-free soldering temperatures and provide reportedly good wetting and void-free joints. The no-clean paste is designed for stencil printing; it is said to print with good definition and without smearing. The paste reduces the frequency of required stencil wiping.
Recommended soldering temperatures reach 235°245°C, performed under air or nitrogen. The paste is compatible with OSP, Ni/Au, silver, tin, and other common surface finishes. Several alloys and powder classes are available. Cobar Solder Products, Londonderry, N.H., www.cobar.com.