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EI Receives Military Contract
March 23, 2007 |Estimated reading time: 1 minute
ENDICOTT, N.Y. The U.S. Department of Defense (DoD) awarded $164 million in contracts for engineering, verification, and production to Endicott Interconnect Technologies, Inc. (EI). The project includes organic packaging; module assembly; PCB design and fabrication; board assembly; verification and test of these systems; and support for logistics, shipping, and storage. The end product is a high-reliability, high-performance computing application.
EI, which initially recommended HyperBGA organic substrates for the application, provided early engineering resources, development efforts, and a prototype and initial module assembly before receiving the contract. Subsequent development and collaborations with the DoD furthered technical involvements and led to follow-on contracts. Post packaging, PCB fabrication, complex board assembly, higher-level integration into card-frame assemblies, and other aspects of the subsystem will fall under EI's responsibilities. Ei will look for design-for-manufacture (DfM) opportunities while fabricating the organic packages, modules, and board assemblies, said James J. McNamara, president and CEO of EI.
The contract comprises an initial $6.5 million for the product development, $37.5 million for product certification, and $120 million of the first production order of fully integrated card-frame assemblies, which will be delivered by year-end. EI was chosen as a domestic source with technology, engineering, and manufacturing capacity that was required to meet the government program's requirements, according to the DoD customer.