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Silver-filled Epoxy Performs Void-free Die Attach
January 25, 2007 |Estimated reading time: Less than a minute
THE WOODLANDS, Texas Huntsman Advanced Materials introduced ARALDITE 7047, a one-component, silver-filled epoxy adhesive for void-free circuitry and chip-to-board bonding. The epoxy reportedly demonstrates high electrical and thermal conductivity and good bond strength.
Formulated without solvents or viscosity diluents, the adhesive features a one-hour cure time (165°C) and four-day work life at room temperature. Properties include an aluminum/aluminum lap-shear strength of 1300 psi, gold/gold die-shear strength of 1700 psi, and glass transition temperature of 130°C; it has a coefficient of thermal expansion (CTE) of 72.