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Companies Create Laser Reflow System
August 10, 2006 |Estimated reading time: Less than a minute
LINCOLN, R.I. The Solder Paste business group of EFD, Inc., and Leister Technologies, LLC, will cooperatively promote their automated solder paste reflow system, said to cut soldering times by nearly 80% over traditional wire and iron soldering methods.
The reflow system combines EFD's auger valve, tabletop robot, and ProcessMate 6500 temperature control system products with a Novolas diode laser from Leister. These elements are contained in a laser-safe certified cabinet. An EFD solder paste reportedly supports sub-second reflow cycles times common with laser heating.
The companies are targeting users who require non-contact, point-to-point soldering with temperature-sensitive parts those in the automotive and medical industries as well as other users requiring discreet, precise heating with controlled, non-splatter solder. The laser system is said to eliminate heat damage to plastics.
The collaborative product meets process, production, and work environment safety and environmental standards outlined in the RoHS Directive. The companies plan to offer on-site technical support and distribute the system globally.