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News
December 31, 1969 |Estimated reading time: 2 minutes
Compiled by SMT Staff
Book-to-Bill Starts 2006 off Right
BANNOCKBURN, Ill. - The IPC IMS/PCB book-to-bill ratio for January 2006 started the year off on a strong note at 1.13. IPC reports the book-to-bill for rigid PCBs was 1.09, while the North American flexible circuit book-to-bill ratio jumped to 1.30. For these segments combined, sales billed (shipments) for January 2006 increased 2.7% year-over-year, and orders booked increased 10.8% from January 2005.
The book-to-bill for January 2006 started the year off right, and combined orders booked increased slightly by 2.7% compared to this time last year.
Siemens A&D Acquires Die Bonder Division
NUREMBERG, Germany - Siemens Automation and Drives (A&D) acquired the die bonder activities of Ottobrunn, Germany-based F&K Delvotec Bondtechnik GmbH, adding die-bonding technology to its business with Siplace SMT placement machines. The acquisition will enable Siemens to broaden its scope in the manufacturing solutions market. Placement machine and die-bonder integration is becoming more prevalent. With this acquisition, Siemens and F&K Delvotec can offer these solutions from one source, noted Farhad Farassat, Ph.D., president, F&K Delvotec. Siemens will integrate the die-bonder activities into the Electronics Assembly Systems Division.
Simco Marks 70th
HATFIELD, Pa. - Simco marks its 70th year in operation, growing from a one-room, Philadelphia-based shop in 1936, to a multinational company with offices in Kobe, Japan; Lochem, Holland; and Hatfield Township, Pa. Simco designs, manufactures, and distributes ionization solutions.
Frost & Sullivan Honors Universal Instruments
BINGHAMPTON, N.Y. - Universal Instruments received the 2005 Frost & Sullivan Technology Award for work in the SMT placement equipment market, specifically its Lightning placement head. When used with the Genesis platform, the head extends the platform concept into the area of high-speed chip placement. “The combination of these innovative products is catalyzing growth within the market as a whole, and increasingly enabling Universal to penetrate its competitors’ customer bases,” said P. Santosh Kumar, Frost & Sullivan Research Analyst.
Cirtronics Uses Aegis’ NPI/MES Solutions
PHILADELPHIA - Milford, N.H.-based Cirtronics selected Aegis Industrial Software to provide new product introduction (NPI) and management enterprise services (MES) solutions for product launches and information flow on the factory floor. Cirtronics also will become integrated using the Aegis xTend Framework, which combines the company’s MES system with a client’s ERP/MRP and supply chain systems.
Indium Notes 72 Years
UTICA, N.Y. - Indium Corporation of America celebrates 72 years as a manufacturer of standard and specialty solders, lead-free alloys, and solder fabrications. Current president William S. Murray, Ph.D., vice president J. Robert Dyer, Jr., and researcher Daniel Gray founded the company in 1934 in a garage in upstate N.Y. The company now has facilities throughout the U.S., as well as China, Singapore, and the U.K. Indium also produces thermal interface materials, underfill materials, and polymers.