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Sanmina-SCI to Show PCB, Backplane Technology at DesignCon '06
February 1, 2006 |Estimated reading time: Less than a minute
SAN JOSE, Calif. — Sanmina-SCI Corp. will exhibit new PCB and backplane technology developments at DesignCon 2006, to be held February 6–9, 2006, at the Santa Clara Convention Center in Santa Clara, Calif. Sanmina-SCI will be located in the PCB Technology Pavilion at booth #819.
Sanmina-SCI will showcase some new innovations in high-speed design, high-performance materials, embedded passives, and engineered via structures. There will be a live demonstration of a 30-layer full-mesh ATCA backplane running 12.5 Gbps with a Bit Error Rate (BER) of 10E-18. Also, a demo illustrating the benefits of Opti-Via optimized backdrilling for cost effectively eliminating via stub parasitics will be available. A white paper titled, "Impedance Characterization and Design Optimization of PCB Embedded Passive Components," will be presented by Nick Biunno, Staff Senior Scientist, and Franz Gisin, Director of Signal Integrity of Sanmina-SCI on February 7th, at 9:20–10:00 a.m. PST.