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IPC Seeks Technical Papers for 12th Lead-free Conference
November 22, 2005 |Estimated reading time: 1 minute
BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries and JEDEC–the Solid State Technology Association announce the 12th International Conference on Lead Free Electronic Components and Assemblies, to take place March 6–8, 2006, in Santa Clara, Calif. Both associations are seeking technical papers from environmental menagers and technical staff on relevant subjects.
Such subjects include:
Policy development policy — European lead-ban status; European/Chinese/other legislation or voluntary activity on hazardous materials and recycling; Legislative compliance and policy enforcement methods, etc.; Supply chain issues; Standards for marking and testing; Materials declarations, part numbers, obsolescence, etc. Production issues Design for lead free production Components, solder, board developments, availability and lead-free compatibility Examples of implementation Reflow, wave and hand soldering, inspection, repair, rework and test, etc. Reliability issues Tin whiskers High-reliability product sectors (automotive, aerospace, etc.) Reliability test data and method developments Environmental considerations Toxicity and risk Recycling Hazardous substance substitutes Research consortia news and updatesThe conference offers time slots between 30–45 minutes long, and some papers may be grouped together in a forum or panel discussion. To submit a 200- to 300-word abstract, along with a brief biography, please send the information via e-mail to LFConf@ipc.org by December 6, 2005.
Presentation materials and papers must be non-commercial in nature, focusing on technology rather than on a company's product. It is mandatory to provide a print-quality paper or hard copies of visuals to be published in the conference proceedings. If accepted, the deadline for presentation and/or paper submission is February 10, 2006.