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New Die Attach Adhesive Combats Substrate Warpage
November 21, 2005 |Estimated reading time: Less than a minute
SAN DIEGO — Advanced Applied Adhesives (AAA)'s AAA3000 Teflon (PTFE)-filled, electrically non-conductive adhesive is said to resolve the substrate warpage problem from attaching large, thin die on thin, organic substrates. Its polymer design offers a 32-MPa modulus, hydrophobic chemistry and hot adhesion. Its 260°C Moisture Sensitivity Level performance has been confirmed by beta-site testing.
AAA3000 also will cure to a void-free bondline on an unbaked substrate, giving the ability to bypass the pre-die-attach substrate pre-bake process. It can be snap-cured in a multi-zone oven or batch-processed in a box oven. It is ideal for thin-die and tight-tolerance applications as an alternative to film and pre-applied adhesives.
One notable feature is a Self-Filleting process, by which the die attach forms a continuous, non-bulky fillet on all four edges of the entire die area once the part is subject to the standard ramp-up cure process. This process reportedly extends the service life for existing die bonders, and allows the users to continue to benefit from the low cost and reliability of a die attach paste.