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X-ray System Combines AOI and AXI Inspection
March 31, 2005 |Estimated reading time: Less than a minute
SAN CLEMENTE, Calif. — YESTech, Inc.'s YTX-5000 dual-technology inspection system combines AOI and AXI inspections for both visible and hidden defects on BGAs, flip chips and other area-array devices. Other typical inspections include solder joints, leads, component presence and position, correct part, polarity, color and thru-hole parts. Features include auto-zoom 130-kV X-ray, off-line programming and real-time SPC data collection. Its image-processing technology integrates normalized correlation and rule-based algorithms, providing full inspection coverage with a low false-failure rate. A standard package library enables program portability across manufacturing lines. Remote programming boosts machine usage, while real-time SPC monitoring is believed to improve yields.