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Assembleon Installs Placement Machine at Auburn University
January 12, 2005 |Estimated reading time: 1 minute
AUBURN, Ala. — The Laboratory for Electronics Assembly and Packaging (LEAP) at Auburn University has announced the installation of an Assembleon ACM Micro into its advanced SMT and flip chip line. The ACM provides fine-pitch and high placement accuracy capability for 01005 chip components, advanced flip chip devices and 3-D modules.
"The advanced placement capability of this system will significantly enhance our research and educational programs," says laboratory director and engineering faculty member Wayne Johnson. "The system is compatible with both laminate and ceramic substrates, and will also be used to assemble 50-µm-thick silicon die onto flex substrates."
With 3,500 sq. ft. of dedicated facilities, LEAP provides electronics manufacturing, packaging, characterization, reliability testing and failure-analysis capability, enabling research in electronics assembly and packaging. The laboratory supports the research efforts of the NASA-JPL University Consortium for Extreme Environment Electronics, the NASA Center for Space Power and Advanced Electronics, and the NSF Center for Advanced Vehicle Electronics, as well as other research projects.
"The projects undertaken by the LEAP facility serve to qualify and define critical process parameters and techniques required to maximize production yield long before a technology becomes mainstream," confirms Brent A. Fischthal, Product Manager. "Moreover, the opportunity to actively participate in the bleeding-edge projects not only confirms the inherent capabilities of the Assembleon ACM Micro, it also ensures Assembleon products will continue to provide the required machine features to handle future technologies."