-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Augering in on Dispensing
September 19, 2024 | Nolan Johnson, PCB007Estimated reading time: 1 minute
Dispensing technology has come a long way since the 1970s, especially with the advent of jet dispensing in the mid-1990s. Traditional methods involved contact dispensing, where a needle touched the substrate to deposit material. Jet dispensing, however, allows dispensing from a distance, improving precision and speed.
In this interview with Sunny Agarwal, a senior applications and process engineer at Camalot Dispensers R&D, we talk about the choice between traditional methods and jet dispensing. Sunny says it depends on material properties, especially viscosity. Dispensing is very specific to application requirements, and excels in scenarios involving tall components, where precise droplet placement is crucial.
Nolan Johnson: Sunny, let's start with a description of Camalot and your role there.
Sunny Agarwal: The company was founded in 1987 and made its initial foray into electronics assembly through the design of an automated liquid dispensing system for an aerospace application. We created a legacy of innovation and a solid reputation of producing high-quality, durable products, and have progressed with a series of high-speed dispensing systems. Innovation has continued around the dispensing technology.
We work on the CBI model—customer-based innovation—so we understand the customer's pain points and build a product to address those pain points. I joined Camalot in 2013 as a research assistant, and now I'm a senior applications engineer. I'm highly involved in the product development of a high-speed fluid dispensing system for PCB assembly applications. I also guide regional process engineering teams located in Asia, Europe, and Mexico on full scale project implementation from in-house process development and testing for new hardware capability assessment to onsite new product evaluation, followed by post-sale operations support.
To read this entire conversation, which appeared in the September 2024 issue of SMT007 Magazine, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Nordson Electronics to Demo Wafer & Panel Packaging Systems at SEMICON China
03/12/2026 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON China 2026, booth 3601 (Hall N2), in the Shanghai New International Expo Centre, March 25-27, 2026.
Rehm Showcases Future Technologies for Electronics Manufacturing Live at APEX EXPO 2026
02/11/2026 | Rehm Thermal SystemsRehm Thermal Systems will present current solutions for conformal coating and dispensing, resource-efficient vapor phase soldering, and nitrogen reflow soldering. Visit us at booth 942 and experience our technologies live on site.
Essemtec Launches the Tarantula Dual Lane – Endless Versatility in Dispensing and Jetting
11/12/2025 | EssemtecEssemtec proudly introduces the Tarantula Dual Lane, our most advanced dispensing platform designed to redefine flexibility, speed, and scalability in modern electronics production.
Nordson Electronics Solutions to Demonstrate Automated Fluid Dispensing and Selective Soldering Systems at productronica 2025
11/06/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for printed circuit board assembly and advanced packaging at Productronica 2025, joining their longstanding distribution partners Amtest Group, stand A2.532, and smartTec Gmbh, stand A2.527, as well as in the Future Packaging Hybrid Live Lab, stand B2.261.
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.