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Nano Dimension’s Additive Electronics Product Line - Essemtec - Received a Global Technology Award

12/11/2024 | Nano Dimension
Nano Dimension Ltd, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announced that its Tarantula Underfill system from its Essemtec product lines received the Global Technology Award for Innovation at the SMTA International 2024 Show in Chicago, Illinois.

Nordson EFD Wins a 2024 Edge Award for the PICO® Nexμs Jetting System

10/08/2024 | Nordson EFD
Nordson EFD, a Nordson company (NASDAQ: NDSN), announced its new-to-market PICO Nexμs jetting system has been recognized by Machine Design magazine with a 2024 Edge Award in the Automation & IIOT category.

Nordson Electronics Solutions to Exhibit at SEMICON Taiwan 2024

08/28/2024 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516. 

New Coherix Technology Benefits Auto, Medical and Electronics Manufacturers

08/14/2024 | PRNewswire
Engineers at Michigan-based Coherix have developed industry-first technology to monitor and adjust the application of adhesives and sealants used to manufacture essential automotive, medical and consumer-electronics products.

Rehm Thermal Systems Presents its Dispensing and Coating System at Bondexpo in Stuttgart

08/14/2024 | Rehm Thermal Systems
Bondexpo, one of the most important international trade fairs for industrial bonding technologies, is opening its doors in Stuttgart for the 17th time: from 8 to 11 October, numerous exhibitors will be presenting their detail and system solutions for joining and connecting components and assemblies in pre-assembly and final assembly – Rehm Thermal Systems will also be there with its dispensing and conformal coating system!
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