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Kester Receives Patent for Encapsulant Technology
January 5, 2005 |Estimated reading time: Less than a minute
DES PLAINES, Ill. — Kester announces that on November 16, 2004, it was awarded with a patent for its Reflow Encapsulant technology, including material and method of use.
The patent covers the epoxy-fluxing technology that enables no-flow underfill technology. The methods and materials covered within the patent allow for attachment of flip chips to electronic assemblies without the need for costly underfill adhesive processes. This novel technology allows for electronic assemblers to reduce the number of process steps in half by eliminating a flux residue cleaning process, and eliminate the capillary underfill dispense step and costly capillary underfill post-curing cycle.
Central to this technology is the use of epoxy technology that acts as a flux during the initial soldering process, and then as an adhesive during the encapsulation process. The soldering or fluxing operation and encapsulation have been combined into a single stage. The patent not only covers the material, but also the application so that the flip chips could attach to the substrate simultaneously with the remainder of the surface-mounted devices.