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Indium's Lee to Present Workshop at CEMCEX
September 17, 2004 |Estimated reading time: 1 minute
Utica, N.Y. — Indium Corp. of America Vice President of Technology Ning-Cheng Lee, Ph.D. will present a workshop entitled, "Lead-free Soldering — Metallurgical Fundamentals, Reflow Application and Challenges" at the CEMCEX Conference in the Czech Republic on October 12 and in Hungary on October 14.
Lee is a world-renowned soldering expert and also has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
The workshop is designed to provide an understanding of the fundamental design considerations of lead-free alloys, with emphasis on metallurgical properties analysis. The performance of representative alloys on reflow soldering will be presented and compared to illustrate the processing potentials of those alternatives. Major challenges encountered will also be discussed, with the focus on metallurgical causes.
In addition to the workshop, Lee will present a short program entitled "The Effect of Lead-free Alloy Composition on Tombstoning."
Indium Corp. is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes and preforms, fluxes, lead-free solder alloys, underfill materials, die-attach materials, and more. For more information, visit www.indium.com. For more information on lead-free workshops, visit www.pbfree.com.