-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
CES 2015: Preview and Predictions
January 5, 2015 | Dan Feinberg, FeinLine Associates, Inc.Estimated reading time: 3 minutes
Once again, I'm preparing to head to Las Vegas for the annual CES show. I'm trying to set priorities regarding who to visit and what to see. It's impossible to see everything, especially now that this gigantic show has spread out with exhibits not only filling the Las Vegas Convention Center, but also now areas at Sands, The Venetian, and Madalay Bay.
Looking back over the last five years of CES and analyzing predictions and items featured by the large exhibitors, you'd likely assume the 2015 show would feature more advanced 3D TVs, as they were predicted to take over the market...wrong!
Last year seemed to promise the end of the PC era and the beginning of a majority using touch interface tablets...again, wrong! In fact, after experimenting with tablets and Net/Chrome books, many companies and individuals are upgrading or replacing their older PCs at a rapid rate. I received several invitations to see new PC components and keyboards. The PC era is far from over--it's actually seeing a bit of a rebirth.
As for displays, the prediction was that the age of the so-called Hi-Def 1080p monitors at an end. That prediction seems correct, but while 4K is becoming main stream, it seems as though the next geneneration of 5K or higher resolution monitors and TVs is almost upon us. The question is: What graphics hardware will power them? My guess is that NVIDIA and AMD will tell us this week.
What do I expect to see and, more importantly, what will we see that will actually be mainstream in two or three years (unlike the 3D TV and an all tablet world)?
Here are my guesses:
- We'll see a great deal of hype about the Internet of Things, but I predict that cost and the pain of implementation will prevent this from becoming fully mainstream except in certain areas like fitness.
- We'll see a slew of smart watches, not only at CES, but later in the year from Apple and others. The talk is that everyone will want or will have a wearable device. My prediction is that unless they do far more than become a remote display or control for your smartphone they will be far from mainstream. The exception, again, being health- or fitness-related wearables.
Page 1 of 2
Suggested Items
Indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities
11/20/2024 | indie Semiconductorindie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.
ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production
11/20/2024 | ASMPTThe high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
Nano Dimension Unveils 3D Printer for Micro Applications at Formnext
11/19/2024 | Nano DimensionNano Dimension, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announces the launch of its Exa 250vx Digital Light Processing (DLP) 3D Printer for micro applications. Developed to enable the creation of superior resolution micro parts at high production throughput, the high-speed Exa was unveiled today for the first time globally at Formnext in Frankfurt, Germany (Hall 11, Stand D22).
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
ZenaTech Participates in Taiwan Trade Mission to Open First Asian Office for ZenaDrone AI Drone Sensor and Component Manufacturing
11/07/2024 | NEWMEDIAWIREZenaTech, Inc., a technology company specializing in AI (Artificial Intelligence) drone solutions and enterprise SaaS (Software-as-a-Service) solutions, announces that company principals are currently participating in a Trade Mission to Taipei, Taiwan as part of an Arizona Commerce Authority (ACA) delegation, with the goal of opening a manufacturing office for its previously announced Spider Vision Sensors Ltd. subsidiary.