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In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
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This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
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CES 2015: Preview and Predictions
January 5, 2015 | Dan Feinberg, FeinLine Associates, Inc.Estimated reading time: 3 minutes
Stay tuned as I will be providing many pictures and comments on what I see daily at CES 2015.
Page 2 of 2Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Restoring U.S. Industrial Agility: Nurturing Domestic UAV Supply Chains
01/13/2026 | James Will, USPAEUnmanned aerial vehicles (UAV) illustrate the risk of globally dispersed electronics supply chains. But they also offer an opportunity for the U.S. to reimagine World War II’s “freedom’s forge” by building domestic electronics and component manufacturing that is hardwired for agility, speed, scalability and resilience.
Lattice Materials Awarded $18.5 Million from the U.S. Department of War
12/30/2025 | PRNewswireLattice Materials (Lattice), an advanced manufacturer specializing in custom-grown silicon and germanium crystals and part of The Partner Companies (TPC), announced it received an $18.5 million award from the U.S. Department of War (DoW) via Title III of the Defense Production Act (DPA) to further strengthen the U.S. supply chain for germanium and silicon.
TopLine Introduces Cost-Efficient Flip Chips with Daisy Chain for Electrical Test Learning
12/23/2025 | TopLine CorporationFlip Chips with Daisy Chain from TopLine Corporation are a cost-efficient way to learn electrical test for engineers seeking to understand and practice necessary techniques for working with Flip Chip components.
ECTC 2026 Announces Student Innovation Challenge
12/23/2025 | ECTCThe premier technical conference and product exhibition for the world’s semiconductor packaging industry, the IEEE Electronic Components and Technology Conference (ECTC), has announced a Student Innovation Challenge for ECTC 2026, the conference’s 76th anniversary.
Target Condition: From Warped to Wonderful—Balancing Your Life, Career, and Your PCBs
12/16/2025 | Kelly Dack -- Column: Target ConditionIn the pursuit of a healthy work-life balance—and a healthy PCB design—one malefactor consistently stands in the way: stress. In life, biological stress creeps in through packed calendars, buzzing notifications, and the tug-of-war between personal and professional demands. Everywhere we look, we’re offered quick formulas to tame it, but some of these cheeky, Western world life hacks are all contrived to keep our minds and bodies from warping under pressure.