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End of 2003 Marks Milestone in Transition to Lead-free Soldering in Europe, Says Soldertec Global
December 19, 2003 |Estimated reading time: 1 minute
UK — According to the second EU Lead-free Soldering Technology Roadmap published by Soldertec Global earlier this year, the end of 2003 marks a significant milestone in the implementation of lead-free soldering technology.
December 2003 is the time that, on average, every electronics assembly manufacturer is expected to have released at least one lead-free product in the European market. Soldertec Global is the only organization in Europe that has established regional guidance recommending timescales for European components manufacturers and electronic assemblers to develop products that will comply with imminent European legislation. By July 2006, the EU RoHS Directive requires the phase-out of hazardous substances such as lead. One of the main aims of the Lead-free Roadmap is to give a clear indication of a timescale for the transition away from the use of lead, allowing electronic manufacturers to compare their performance with others.The target date of December 2003 refers to products within the scope of the EU Directive on Restriction of Hazardous Substances for Electrical and Electronic Equipment (RoHS), and permits the use of lead in areas where exemptions exist within the legislation. For example, within high melting point solders containing more than 85 percent lead. Industry data collected by a survey of the EU electronics industry in early 2003 was used to compile the EU Lead-free Soldering Technology Roadmap.
Soldertec is a membership-based organization focusing on research into soldering technology, including lead-free issues. For more information, visit www.lead-free.org.