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World Market for Thermal Management Products to Reach $5.8 Billion by 2008, Says BCC Research
October 13, 2003 |Estimated reading time: 2 minutes
Norwalk, Conn. — According to a soon-to-be-released updated report from Business Communications Co. Inc., RGB-185 The Market for Electronic Thermal Management Technologies, the world market for thermal management products will grow from about $3.3 billion in 2003 to $5.9 billion by 2008, at an average annual growth rate (AAGR) of 12.1 percent.
Although thermal management technology is mature, the market is still active in terms of product development. In the early 1990s, when the semiconductor industry began to scale the microprocessor, computer manufacturers came to understand the importance of a formal approach to thermal management. If the semiconductor industry had continued its development road map, the tendency to just add a generic heat sink to the power module would have been an inadequate control against excess heat.
It was at that juncture that thermal management products became linked to the computer market intricately, based on the expectation that higher density semiconductors would raise the computer's thermal handling requirements. This relationship to the computer industry, however, took an unexpected turn in the late 1990s, when demand dropped off in the computer markets and companies took to using outsourced manufacturing in an effort to restructure their profitability. Coupled with a reduction of investment in new product development, these actions caused the thermal management market to experience its own downturn. Revenue growth slowed, and many suppliers experienced severe commodity pricing pressures in a new expanded market that required them to compete with contract manufacturers from all over the globe.
The 12.1 percent AAGR reflects the return of growth to the electronics markets. During its slow years, the thermal management industry had introduced many improvements in the thermal handling capability of products. There had also been the development of highly efficient, high-yield manufacturing methods — the adoption of which had been put on hold until recently.
The current thermal management market has been rekindled with new design starts, and the emergence of new applications that require completely new cooling solutions. The 2+ GHz Desktop, prolific growth of handheld devices and integrated Internet connectivity device, and the demand for wireless base stations and large Internet infrastructure equipment all present new challenges to the thermal management industry.
Thermal management technology will be highly valued, even after the maturation of cooler-by-design computer systems that began to appear at the turn of the century. New materials and components that are now available for next-generation applications are already expanding the definition of efficiency in electronics. Once employed only as a means to prevent thermal failure, thermal management technology is constantly in demand because it can improve the performance of super-fast, high-power and high-temperature electronics systems.
For more information, visit www.bccresearch.com.