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SOLDERTEC Announces Winners of Lead-free Solder Awards 2002
December 18, 2002 |Estimated reading time: 2 minutes
UK -- SOLDERTEC announces that three lead-free solder award winners have been selected in 2002 from the nominations received from industry. This year's award selections have been designed to reflect the recent rapid and significant advances in lead-free knowledge and activity in North America while at the same time rewarding individuals with a long-term involvement in lead-free. Each winner has been active in lead-free in that region for a number of years, and each have participated in the development of lead-free from the early stages of the technology.The winners are:
- Dongkai Shangguan, Ph.D., director of advanced process technology, Flextronics US and previously of Ford/Visteon
- David Bergman, VP standards, technology and international relations, IPC - Association Connecting Electronics Industries
- The Lead-free Component Focus Group, Chaired by Mark Kwoka of Intersil, and with core group members Lee Whiteman (ACI), Jeff Cannis (Amkor), Gerald O'Brien (Photocircuits), Dave Hillman (Rockwell Collins), Michael Toben (Shipley Ronal) and Rob Schetty (Technic)
These winners reflect a range of activities on lead-free soldering from industrial road mapping and leadership, to detailed technical studies. Shangguan has been selected to receive a Lead-free Solder Award in appreciation of his long-term involvement in lead-free research and implementation. This is also in recognition of his industry leadership through his work both at Flextronics and previously as senior technicalsSpecialist at Ford/Visteon Electronics Division. For example, Shangguan formed and leads the "EMS Forum on Lead-free PCB Assembly," is involved with various standards bodies, has published various papers and other publications, and directed Ph.D. studentships. He has also directed the work at Flextronics to qualify 17 global factories for lead-free production. Bergman has been granted the award in recognition for his leadership of U.S. industry towards lead-free implementation. His contributions include lead-free roadmapping, organization of landmark conferences and events, dissemination and training activities, and participating on international lead-free co-ordination activities. The Lead-free Component Focus Group has also been granted an award in recognition of their pioneering work on lead-free components in the US. The group has carried out research on solderability, moisture sensitivity, soldering processes, assembly reliability and tin whisker growth. Members of the group are also involved in development of standards for lead-free components. The SOLDERTEC award was established in 1999 to mark the launch of the Tin Technology Lead-free Soldering Centre (SOLDERTEC) and was granted in its first year to Kenichiro Suetsugu, Ph.D. of Panasonic, Japan in recognition of the successful introduction of lead-free soldering in mass production of the portable MiniDisc SJ-MJ30-S.
Tin Technology is a membership-based organization involved in the research, development and marketing of tin-based technologies. For more information, visit www.lead-free.org. SOLDERTEC is a membership-based organization. Members receive a unique package of benefits that aims to provide access to leading-edge lead-free research and information within a community of key electronics industry technologists.