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Ask and Answer - September 4, 2002
September 5, 2002 |Estimated reading time: Less than a minute
QUESTIONSLes Pearson of California, Md., writes: I work for a company that repairs a RF test set for the Department of Defense. Essentially the unit is made up of 24 RF submodules. Each submodule has several hybrid ceramic substrates with gold print and SMT components on top. The bottom surface is glued in a shallow aluminum block cavity using conductive epoxy. Removal of the substrate for rework is difficult, expensive and time consuming. In trying to rework the substrate while attached to the aluminum block, I am unable to apply enough localized heat to effectively cause solder to flow before the heat rapidly dissapates.
Chandler, Ariz. -- Building on the business alliance established at the beginning of this year, Amkor Technology Inc. has formed a technology development alliance and manufacturing services agreement with Agilent Technologies Inc.