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NEMI Launches New Lead-free Hybrid Assembly and Rework Project
July 17, 2002 |Estimated reading time: Less than a minute
This project is a follow-on to NEMI's highly successful Lead-Free Assembly Project, a three-year effort that recommended an industry-standard lead-free alloy for solder paste reflow, and carried out extensive testing to determine reliability of the alloy compared to eutectic tin-lead solder.
Minneapolis -- The Surface Mount Technology Association (SMTA) announces the recipient of the 2002 Charles Hutchins Educational Grant.