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Component Removal System
December 31, 1969 |Estimated reading time: Less than a minute
The Freedom HGR 2000 is a rework system for component placement, soldering and removal. It is suitable for BGA, µBGA, flip chip, and fine-pitch process development and prototype production. The system features Windows-based control software with one-touch cycle initiation. The topside heating system is said to apply precise quantities of forced convective heat directly to the component and has adjustable gas temperature, gas flow and nozzle height. A forced convective bottomside process heater and large-area IR preheater reportedly minimize component-level temperature variations and board warping. The component-to-pad vision, work board holder, and precision, motorized Z-axis are said to ensure placement accuracy of ±0.001".
Conceptronic Inc.
Portsmouth, N.H.