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Reworkable Flip Chip Underfills
December 31, 1969 |Estimated reading time: Less than a minute
An epoxy-based liquid underfill, 3567 is compatible with polyimid-passivated flip chip, BGA and CSP assemblies. It is said to be the first commercially available reworkable underfill - it reportedly permits an area-array device to be replaced after testing determines it is defective, minimizing the discarding of entire boards. The epoxy-based liquid cures in five to 15 minutes when exposed to temperatures of 150° to 165°C and penetrates gaps as small as 0.001". Defective flip chip packages can reportedly be removed by heating the package and the underfill for one minute at standard rework temperatures (210° to 220°C), then applying torque.
Loctite Corp.
Rocky Hill, Conn.