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Low Surface Energy Coatings Rewrite Area Ratio Rules
May 7, 2013 |Estimated reading time: Less than a minute
With today’s consumer technologies driving the need for denser and more compact devices, the assembly process for surface-mounted devices has become increasingly more difficult. With the mixture of components requiring a broader range of print deposition volume, various techniques are used in an attempt to ensure consistent and appropriate paste volume is achieved.
These techniques include step etching a stencil locally on a targeted device, promoting electroformed smooth-wall nickel stencils, and laser cutting newer grade stencil materials. This paper focuses on the relevant attributes affecting the properties of solder paste release and introduces the effects of surface free energy with respect to key elements making up the stencil printing process. Read the full article here.This article originally appeared in the April 2013 issue of SMT Magazine.