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Pusan National University Develops One-Step 3D Microelectrode Technology for Neural Interfaces

02/28/2025 | PRNewswire
Neural interfaces are crucial in restoring and enhancing impaired neural functions, but current technologies struggle to achieve close contact with soft and curved neural tissues. Researchers at Pusan National University have introduced an innovative method—microelectrothermoforming (μETF)—to create flexible neural interfaces with microscopic three-dimensional (3D) structures.

In-mold Electronics: The Convergence of Innovative Materials and Manufacturing Techniques

08/07/2024 | Linda Stepanich, IPC
Paavo Niskala, a noted expert in in-mold electronics (IME) at TactoTek, recognized the need for an industry-wide standard when one of his automotive OEM clients asked him how to test a prototype TactoTek had developed. That question led to the creation of the first-ever IPC standard of this type, IPC-8401, Guidelines for In-Mold Electronics, to be released later this year.

Delvitech’s Cutting-Edge Technology Overcomes the Conventional Boundaries of Optical Inspection at SMT Connect

05/29/2024 | Delvitech
Not only does Delvitech offer an innovative solution aimed at revolutionizing automatic 3D optical inspection through seamless integration of artificial intelligence, but it stands out as the sole provider to deliver exceptional results in inspecting electronic components previously deemed challenging to assess.

Autonomous Driving: Peters at Forefront of Technology

01/19/2024 | Peters
MID4automotive: This is a publicly funded research project in the field of microelectronics/automotive, where Peters is involved alongside numerous other electrical engineering companies and institutes.

Durability and Cost Benefits Drive Mil-Aero Demand for OCPP

01/17/2023 | Sam Sadri, QP Technologies
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).
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