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Compal Collaborates with Viasat

12/02/2024 | Compal Electronics Inc.
Compal Electronics, Inc. (Compal) announced the collaboration with Viasat, a global leader in satellite communications, to officially include the APAL Hestia NTN IoT Dongle in Viasat’s ELEVATE Marketplace, further driving innovative applications of satellite Internet of Things (IoT) technology.

TPCA Strengthens Thailand's PCB Industry with Talent Development Initiative

11/29/2024 | TPCA
The Taiwan Printed Circuit Association (TPCA) is taking significant steps to support the growth of Thailand's PCB industry. Acknowledging the rising demand for skilled professionals in the region,

Biden-Harris Administration: CHIPS Incentives Awards with BAE Systems and Rocket Lab

11/27/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight

11/26/2024 | Koh Young Technology
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.

SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium

11/26/2024 | SMTA
The SMTA is excited to announce the technical program for the second annual Ultra High Density Interconnect Symposium which takes place on January 23, 2025 in Peoria, Arizona, USA.
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