It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Techcon Systems to Exhibit at AUTOMATION 2015 India
July 14, 2015 | Techcon SystemsEstimated reading time: 2 minutes
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, will exhibit in Booth I-41, Hall 1 at AUTOMATION 2015, scheduled to take place August 24-27, 2015 at the Bombay Convention and Exhibition Center in Mumbai, India. Company representatives will showcase the new TSR2000 Bench Top Robot and the full Techcon range of fluid dispensing solutions.
The TSR2000 Bench Top Robot Series delivers consistent, high-performance dispensing results at an affordable price. This versatile dispensing platform is ideal for a wide range of fluid dispensing applications, from inline to batch and for the following applications: dispense dots of solder paste, form-in-place gasket, filling, potting, encapsulation, bonding, coating and many more. Three models are available (TSR2201, TSR2301 and TSR2401) to accommodate a wide range of working envelopes. The easy-to-program robot features dedicated fluid dispensing software, eliminating the need for complex robot language programming. With fully integrated positioning and fluid dispensing functions, the system is compatible with all Techcon Systems syringes, valves and jet dispensing systems.
Techcon Systems will display the TS6500 Series cartridge mixer providing complete automatic mixing of two-component material filled in a cartridge kit. The features rich TS6500 Series accommodates all standard size cartridge kits ranging from 2.5 oz. (74 ml) to 20 oz. (591 ml) and is immediately usable anywhere in the world with its accompanying tools, accessories and universal power supply. Equipped with an automatic fluid level sensing device and user-friendly electronic control system, the TS6500 Series mixer allows for a quick, simple setup process. The automatic injection feature provides even distribution of the hardener into the resin during the mixing cycle to ensure a uniform mixed result.
Techcon Systems also will showcase its wide array of fluid dispensing components, ranging from disposable accessories to complete digital controlled dispensing systems and precision valves for automation. For more information, please contact the Techcon Systems team by visiting www.techconsystems.com.
About Techcon Systems
Techcon Systems was established in 1961 to service industrial manufacturing markets and has continued to be a leader in fluid dispensing systems and products. In 1996, OK International acquired Techcon Systems, providing a strong global sales channel, with direct subsidiaries in the UK. Today, Techcon represents OK International’s Industrial Product Division. Currently focusing on fluid dispensing systems, Techcon’s components are used in medical, automotive, telecommunications, aerospace, and industrial applications worldwide, helping to improve manufacturing processes and increase the customers’ bottom lines. Techcon offers an array of fluid dispensing products and provides dispensing components ranging from disposable accessories to complete microprocessor-controlled dispensing systems, and precision valves. For more information, visit the company at www.techconsystems.com.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.