SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 1
Standard of Excellence: Training Your Team to Excel in Customer Service
Smart Automation: What Industry 4.0 Means for Mid-sized Electronics Manufacturing
IPC Releases Report on Lead-free Electronics in Mil/Aero Applications
July 16, 2015 | IPCEstimated reading time: 1 minute
IPC has released a new market research study, "Issues and Outlook for Lead-Free Electronics in Military and Aerospace Applications", that examines the current and future state of lead-free usage in high-reliability applications, as well as the impact usage will have on the industry.
The study examines the use of reballing lead-free assemblies in order to meet high-reliability requirements, and it estimates the average costs that this workaround typically adds to board production. In addition, the study also assesses the price differential of scarce components and identifies many types of components that survey respondents categorize as scarce or unavailable in leaded versions.
The report also uncovered tipping points at which the industry can be expected to go fully lead free. These tipping points and other indicators are the basis for a 10-year forecast of the ratio of tin/lead to lead-free solder consumption, both worldwide and in North America.
The growing cost differential between leaded and unleaded materials and components will eventually force a shift to lead-free electronics in high-reliability applications. The study provides a look at how manufacturers are coping with these problems today and how this trend will affect the industry in the future.
For more information on the report, click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.