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Advancements in High-reliability Alloys for Automotive and High-performance Applications

05/22/2025 | Barry Matties, I-Connect007
At IPC APEX EXPO, MacDermid Alpha Electronic Solutions showcased its latest innovations in SMT assembly materials designed to meet the growing demands for reliability and sustainability in automotive and high-performance applications. In this interview, Ebad Rehman, business product manager, discusses the evolution of high-reliability alloys, spotlighting ALPHA Innolot, a proven solution developed in response to the automotive industry’s increasing expectations for durability and performance under harsh operating conditions.

Trouble in Your Tank: Yield Improvement and Reliability

05/22/2025 | Michael Carano -- Column: Trouble in Your Tank
There’s a simple rule of business in manufacturing: “It is all about yields.” Higher yields for your products allow for increased profits and satisfied customers. When there are lower yields, overall cost to manufacture increases, and the additional time and strain on the factory floor affect the entire operation. Lower yields are often the result of “process drift,” when critical process parameters and specialized plating additives fall outside their acceptable ranges.

Indium to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025

05/19/2025 | Indium Corporation
As a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore.

The Test Connection Inc. Appoints USM Reps as Exclusive Sales Representative in Mexico

05/13/2025 | The Test Connection Inc.
The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the appointment of USM Reps as its exclusive sales representative in Mexico.

Innovative Technology Advancements in Test: HATS² Technology and Its Impact on Reliability Testing

05/14/2025 | Barry Matties, I-Connect007
Ensuring the reliability of printed circuit boards (PCBs) has become increasingly difficult and critical, yet the development of advanced testing methodologies is essential to meeting industry demands and addressing persistent challenges. One significant innovation is the High Acceleration Thermal Shock (HATS²) test system, which transforms how reliability testing is conducted. After 40 years in the testing business at Microtek, Bob Neves is beginning a new journey with his company, Reliability Assessment Solutions Inc. (RAS).
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