-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
ASE Receives International Trade Award from Taiwan's MOEA
August 3, 2015 | ASE GroupEstimated reading time: 1 minute
Advanced Semiconductor Engineering Inc., a provider of IC packaging and testing services as well as electronics manufacturing services (EMS), has received the Excellent Importers & Exporters Certificate for Outstanding Contribution to International Trade, awarded by the Bureau of Foreign Trade, Ministry of Economic Affairs, Taiwan. The award recognizes ASE's achievements in global trade and the development of overseas markets. A total of ten companies are selected as the Top Importers & Exporters each year. This year, ASE was ranked fourth, moving up from seventh position last year.
As a world leader in semiconductor assembly and test, ASE’s success is derived from the relentless pursuit of investing in technology innovation, building efficiency with ecosystem partners, and, collaborating with market leaders globally. ASE’s vast experience in IC assembly and test, combined with proven efficiency in managing complex IC and material logistics, has enabled the company to attain a leadership position in semiconductor System-in-Package. ASE's competency in System-in-Package technology will help support customers to establish market leadership in their push for next generation applications in the era of Internet-of-Things, higher levels of integration, and on-premises intelligence.
"The ASE Group is an enterprise deeply rooted in Taiwan, and is proud to have contributed significantly to the economic growth experienced over the past three decades. ASE will continue to drive investments and develop its resources within Taiwan in order to reach out to our global customer-base," said Dr. Tien Wu, Chief Operating Officer, ASE Group.
About ASE
Advanced Semiconductor Engineering Inc. (ASE) is the world's largest independent provider of packaging services and testing services, including front-end engineering testing, wafer probing and final testing services, as well as electronic manufacturing services through Universal Scientific Industrial Co. Ltd. With advanced technological capabilities and a global presence spanning Taiwan, China, Korea, Japan, Singapore, Malaysia and the United States, ASE, Inc. has established a reputation for reliable, high quality products and services. For more information, visit the company's website.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Sigma Engineering's Recycling and Regeneration Systems for PCB Etching
05/02/2024 | Real Time with...IPC APEX EXPOEvan Howard of Schmoll America interviews Kristoffer Bjorklund, Sigma Engineering's supply chain manager. We learn about Sigma's recycling and regeneration systems for PCB industry etching and the benefits and challenges of implementing these systems in existing factories.
Boeing T-7A Red Hawk Triples Progress
05/01/2024 | BoeingThe Boeing T-7A Red Hawk achieved three recent milestones, propelling the advanced pilot trainer for the U.S. Air Force forward.
Merlin Flex invests in New Schmoll Direct Imaging System
04/30/2024 | Merlin Flex LtdMerlin Flex has fully installed and commissioned its 2nd Schmoll MDI Direct Imaging system. This new machine includes a twin bed, 4 head system which enhances Merlin Flex’s direct imaging capability for its 1.4M long flexible circuits.
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
TSMC Celebrates 30th North America Technology Symposium
04/29/2024 | TSMCTSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.