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i3 Electronics Earns Recertification to AS9100C and ISO 13485:2003
August 14, 2015 | i3 ElectronicsEstimated reading time: Less than a minute
i3 Electronics, Inc. (i3) announced today that it has recently completed assessment for recertification to several critical Quality Management Standards including AS9100C (Aerospace, Military and Defense Standard) and ISO 13485:2003 (Medical Devices).
“i3 Electronics has a strong Quality Management System, and is committed to the on-time delivery of high quality products, that exceed our customer demands. These recertifications are a testament to the dedication of all i3 associates to our Quality System”, stated Dale Kersten, Executive VP and Chief Business Officer at i3.
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging; advanced assembly; reliability and signal integrity labs; high speed back plane & press fit assembly; and flexible electronics fabrication & assembly. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial, and medical, where highly reliable products built in robust manufacturing operations are critical for success.
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Foxconn's Rotating CEO, Yang Qiujin, Named One of Asia's Most Influential Women
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Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.