BAE Systems' PHOENIX Networking Radios Prove Capabilities
August 25, 2015 | BAE SystemsEstimated reading time: 1 minute
BAE Systems’ PHOENIX-2C radios successfully provided tactical networking capabilities during recent U.S. Army exercises, enabling soldiers to communicate more than 20 kilometers, double the mid-tier network requirement.
Fully interoperable with other Joint Tactical Radio Systems currently in use, the PHOENIX radios were tested earlier this month at Ft. Huachuca, Arizona.
“We have developed a radio that gives our soldiers a critical advantage, by seamlessly, securely, and reliably bridging the communications gap between the soldiers on the ground – both on the front lines and in the rear – and those at headquarters,” said Joseph Senftle, vice president and general manager of Communications and Control Solutions at BAE Systems. “We look forward to participating in the next phase of field testing.”
These exercises were designed to begin assessing candidate capabilities for mid-tier networking radios and were part of an excursion linked to Network Integration Evaluation (NIE) 13.1. The excursion will provide the U.S. Army with feedback as it moves through its mid-tier radio candidate assessments. NIE 13.1 supports comprehensive Army modernization plans to support a synchronized vehicle and network fielding strategy that prioritizes capabilities for deployed forces and improves alignment of limited resources.
Using PHOENIX radios, soldiers can communicate voice, data, and video for enhanced battlefield awareness. The high-throughput family of radios includes three variants which allow for multiple configurations – a two-channel with SINGCARS, a two-channel, and a four-channel that each uses the next-generation, government-owned Wideband Networking Waveform (WNW) and Soldier Radio Waveform (SRW). With the robust WNW, all PHOENIX variants provide full anti-jam modes to protect communications in hostile environments and when using jammers such as CREW. This off-the-shelf radio system offers a low size, weight, and power design that integrates easily into the SINGCARS radio space already allotted on U.S. Army ground combat vehicles.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Technica USA Partners with Creative Electron
10/22/2025 | Technica USATechnica USA is proud to announce the partnership with Creative Electron Inc. located in San Marcos, CA.
MES Software Tools Need Thoughtful Integration
10/21/2025 | Nolan Johnson, SMT007 MagazineThe Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence, connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Elementary, Mr. Watson: High Power: When Physics Becomes Real
10/15/2025 | John Watson -- Column: Elementary, Mr. WatsonHave you ever noticed how high-speed design and signal integrity classes are always packed to standing room only, but just down the hall, the session on power electronics has plenty of empty chairs? It's not just a coincidence; it's a trend I've observed over the years as both an attendee and instructor.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).