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Molex Completes Acquisition of Teramount Ltd.

05/07/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.

NVIDIA, Corning Partner to Boost U.S. AI Manufacturing

05/06/2026 | BUSINESS WIRE
NVIDIA and Corning Incorporated announced a multiyear commercial and technology partnership to dramatically expand U.S.-based manufacturing of the advanced optical connectivity solutions needed to power next-generation AI infrastructure.

Boeing Delivers ViaSat-3 Flight 3 Spacecraft to Viasat

04/13/2026 | Boeing
Boeing announced, delivery of the ViaSat-3 Flight 3 (VS-3 F3) spacecraft to Viasat. Built on Boeing’s high-power 702MP+ platform and integrated at Boeing’s El Segundo facility in California.

IPC CFX Demo Line Debuts in Korea at EMK 2026

04/10/2026 | Global Electronics Association
At Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.

Keysight, Sateliot Win European Space Agency and GSMA Foundry Challenge for 6G Innovation

04/08/2026 | Keysight Technologies, Inc.
Keysight Technologies, Inc., together with Sateliot, has been named a winner of the fifth annual European Space Agency (ESA) and GSMA Foundry Innovation Challenge for its joint project, “Blockchain-enabled anomaly detection end‑to‑end solution for 5G Non‑Terrestrial Networks.”
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