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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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LPKF Strengthens Strategic Structures for LDS and Rapid PCB Prototyping
August 31, 2015 | LPKF Laser and ElectronicsEstimated reading time: 1 minute
LPKF Laser & Electronics AG enhances its structures in two relevant divisions. Two experienced engineers take over new positions of im-portant interfaces with customers.
Malte Fengler graduated from Hannover University earning a degree in electrical engineering and radio frequency technology. Since 2011 he has worked for the laser equipment manufacturer LPKF in the field of Molded Interconnect Device (MID) technology. This technology enables the production and placement of circuit layouts on complex three-dimensional carrier structures. More than half of the 3D components are produced with the LPKF LDS process (Laser Direct Structuring). Fengler is concerned with process engineering, feasibility studies, global cus-tomer support, and applications. In addition, he is in charge of existing as well as newly developed LDS substrate materials, and process con-sulting.
In August 2015, he succeeds Stephan Krause as the new Strategic Product Manager MID and takes over the responsibility for current and future markets as well as new applications in the field of LDS MID tech-nology
Stephan Krause has acted as a Sales Engineer since 2002 and support-ed the LPKF team as Strategic Product Manager LDS since August 2012. In October 2015, he moves to the Rapid PCB Prototyping division and takes charge of the worldwide RP sales activities. Moreover, he manages the contacts with the RP distributors.
Stephan Krause (left side) and Malte Fengler (right side) will work closely together in their new roles.
About LPKF
LPKF Laser & Electronics AG manufactures machines and laser sys-tems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the work-force is engaged in research and development.
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