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Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line

06/09/2025 | Dr. Eyal Weiss, Cybord
As the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.

Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow

06/06/2025 | BUSINESS WIRE
Keysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.

IPC Releases Latest Standards and Revisions Updates

06/05/2025 | IPC
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.

STARTEAM GLOBAL Unveils Innovative Additive Solder Mask Process

06/02/2025 | STARTEAM GLOBAL
STARTEAM GLOBAL, a leading PCB manufacturer, has introduced a revolutionary additive solder mask process at its Flero STARTEAM (FST) factory in Italy, leveraging digital inkjet technology to enhance production efficiency and sustainability.

Advint Delivers Advanced Electroplating Training to Triangle Labs 

06/02/2025 | Advint Incorporated
During the last week of April, Advint Incorporated conducted a comprehensive two-day on-site electroplating training session for the technical team at Triangle Labs, Inc., a key innovator in the printed circuit board space. The training was structured to align with the demands of high-reliability plating processes suitable for RF and high-frequency substrates.
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