MIT Joins $171M Consortium on Manufacturing Flexible Electronics
September 10, 2015 | MITEstimated reading time: 4 minutes

MIT is one of several universities in Massachusetts that will support a new federal initiative to boost manufacturing innovation in the area of flexible hybrid electronics (FHEs), a high-potential new generation of electronics that are still in the early stages of development.
MIT will work closely with the University of Massachusetts at Amherst — the leader of the Massachusetts node of the collaboration — and other partners in the Northeast, to support the Manufacturing Innovation Institute for Flexible Hybrid Electronics, managed by FlexTech Alliance, a non-profit research and development group based in San Jose, California.
Members of the consortium include industry leaders such as Boeing and General Motors, as well as a number of leading research universities. A total of $171 million in funding — $75 million in federal grants and more than $96 million in nonfederal contributions — support the initiative.
This newest Manufacturing Innovation Institute, funded by the Department of Defense, is the most recent of seven launched in the last three years by the Obama administration to reinvigorate manufacturing leadership and job creation in the U.S. MIT also plays a key role in two of these previously announced institutes, the American Institute for Manufacturing Integrated Photonics (AIM Photonics) and Lightweight Innovations for Tomorrow (LIFT).
Electronics of the future
Stretchable, bendable, wearable next-generation electronics open the doors to countless innovations — from smart bandages to sensors embedded in bridges and airplanes — but the technology is not yet developed enough for the devices to be manufactured and sold at a large scale and low cost.
For consumers, low-cost FHEs could make a big impact, particularly for medical care. Advances in these devices and their manufacturing could eventually create a world where someone could walk into a local drugstore and buy bandages that monitor and treat wounds, or an arm patch that measures glucose levels and delivers insulin.
“Right now, you can buy a Band-Aid, but you can’t buy — at any reasonable cost — a Band-Aid that would monitor your blood flow and treat your burn,” says Krystyn Van Vliet, a professor of materials science and engineering and biological engineering, and MIT faculty lead for the Advanced Manufacturing Partnership 2.0, the second part of a public-private partnership whose work led in part to the creation of the manufacturing innovation institutes. “There’s a big difference between being able to make something and being able to make something so that it’s a commercial product that creates U.S. job opportunities.”
A dependable means of manufacturing in the U.S. would be advantageous for the military in making use of FHEs — for example, with sensors embedded in military uniforms or airplanes. “Consumers may be buying flexible electronics this year or this decade, but if all of the key components or a few key steps have to be manufactured in another country, then it’s not as easy for the military to make use of those flexible electronics,” Van Vliet explains.
Domestic manufacturing would also be an economic boon. “A lot of really great innovations get invented in the U.S., but you want to invent it here and make it here,” Van Vliet says. “If you can both invent and make in the same place, then you’re able to invent more quickly, invent better, speed standards of living, and create rewarding jobs. If your making happens overseas, then you don't have that rapid feedback.”
Partnership for progress
The MIT research team that will be spearheading the Institute’s role in the collaboration includes Brian Anthony, David Hardt, John Hart, and Sang-Gook Kim of the Department of Mechanical Engineering; Marc Baldo, Duane Boning, and Vladimir Bulović of the Department of Electrical Engineering and Computer Science; and Karen Gleason of the Department of Chemical Engineering.
“MIT has assembled a team of 10 PIs with extensive history collaborating with industry and successfully translating research to scaled manufacturing,” says Anthony, co-director of MIT’s master of engineering in manufacturing program and Medical Electronics Device Realization Center, and MIT’s lead investigator for the new research partnership. “[We expect] to contribute technical demonstration projects that draw on our experience in design and manufacturing of components of flexible hybrid electronics, including durable electrodes and sensors and rugged energy storage devices, and applications thereof, such as flexible medical electronics.”
Researchers will be working to develop and improve flexible electronic devices as well as low-cost and scalable ways to manufacture those devices, like roll-to-roll manufacturing: the process of creating FHEs on a rolls of flexible plastic or foil similar to plastic wrap and aluminum foil.
“Manufacturing innovation is part of that ‘mens-et-manus’ mentality here,” Van Vliet says, referring to MIT’s motto of “mind and hand.” “It’s thinking about things and then being able to make things. The maker movement is an important part of that, but ‘maker’ means ‘make it once.’ Manufacturing means I can make it many times, and in a way that lots of people can make use of it.”
In addition to research efforts, the manufacturing initiative includes a program in education and workforce development run locally by the regional branches of the partnership. MIT expects to contribute experience in education and training programs honed by its previous collaborations with industry. The Institute’s education and workforce contributions will include educational software, instructional design expertise, manufacturing curriculum content, coordination with edX, and manufacturing education leadership.
“In order for this to be possible, the state government has to be very supportive of manufacturing innovation, and the Massachusetts state government has been tremendously so,” Van Vliet says. “We are grateful for support from Governor Baker's administration for the impact that this initiative’s teaching, training, and commercialization opportunities will have on the Commonwealth's economic activity.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Smartphone Production Rises 4% QoQ in 2Q25 as Inventory Adjustment Ends
09/12/2025 | TrendForceTrendForce’s latest investigations reveal that global smartphone production reached 300 million units in 2Q25, up 4% QoQ and 4.8% YoY, driven by seasonal demand and the recovery of brands such as Oppo and Transsion following inventory adjustments.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
Delta Electronics Posts 26.7% Growth in Sales Revenues for August
09/12/2025 | Delta ElectronicsDelta Electronics, Inc. announced its consolidated sales revenues for August 2025 totaled NT$47,860 million, a 26.7 percent increase as compared to NT$37,770 million for August 2024 and a 5.4 percent increase as compared to NT$45,397 million for July 2025.
Flex Named to TIME's World's Best Companies List for Third Consecutive Year
09/12/2025 | FlexFlex announced its inclusion on the TIME World's Best Companies 2025 list. This marks the third consecutive year the company was included in this prestigious ranking, which recognizes top-performing companies across the globe.
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.