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Advanced Electronics Packaging Digest

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Suggested Items

Fujitsu Develops Self-Evolving AI Agent Technology for Business Operations

05/25/2026 | JCN Newswire
Fujitsu Limited announced the development of a self-evolving multi-AI agent technology that enables multiple AI agents to perform tasks as a team, continuously and safely learning from daily execution results, human feedback, policy revisions, and specification changes.

San Francisco Circuits Achieves CMMC Level 2 Certification

05/22/2026 | San Francisco Circuits
San Francisco Circuits, Inc., a leading printed circuit board fabrication and assembly supplier serving commercial and defense markets, announced that it has achieved Final Cybersecurity Maturity Model Certification (CMMC) Level 2 status following a successful independent assessment by an accredited Certified Third-Party Assessment Organization (C3PAO).

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/22/2026 | Nolan Johnson, I-Connect007
It’s been a busy week in the news. I could legitimately have published another five items because there were so many meaningful topics. So, I start with attorney James Kim, who returns to update us on metals tariffs. Brian Chislea and Cody Schoener from Dow recently published a book on UV curable conformal coatings. The Taiwan Printed Circuit Association has launched a PCB-specific AI knowledge base. SEMI FlexTech is seeking proposals for advancing flexible hybrid technologies, and the Global Electronics Association has launched the Global Electronics Policy Council, unifying its advocacy voices.

Technica USA Highlights PCB Assembly Solutions at Oregon SMTA Expo & Tech Forum

05/21/2026 | Technica USA
A longstanding supporter of the SMTA, Technica USA participated in the Oregon SMTA Expo & Tech Forum held Tuesday, May 19, at the Wingspan Event & Conference Center.

imec Unveils World-First Quantum Dot Qubit Device Using High-NA EUV Lithography

05/20/2026 | Imec
This week, at ITF World, imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents a world first: a quantum dot qubit device fabricated using High NA EUV lithography.
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