-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Eurocircuits Issues Customer Testimonial on Ucamco's Ledia
September 16, 2015 | UcamcoEstimated reading time: Less than a minute
In January 2015, Eurocircuits, a leading European PCB prototype manufacturer, purchased a Ledia SD direct imager from Ucamco for its manufacturing facility in Eger (Hungary).
“Conventional phototool-based exposure are very expensive for us, because we use the films to make relatively small numbers of panels, yet we can't re-use them," said Luc Smets, managing partner at Eurocircuits. "We realised some years ago that DI would eliminate our film costs, and so we started tracking our materials and processing costs vs. the costs of investment in the technology. Last year, the numbers finally made sense: DI systems costs had decreased sufficiently, and at our Eger plant alone, we used a record 36,000 films for inner and outer layers, and 25,000 films for soldermask. It was time to make the switch."
Suggested Items
QuantumScape, Murata Announce Framework for Ceramics Collaboration
04/25/2025 | BUSINESS WIREQuantumScape Corporation, a global leader in next-generation solid-state lithium-metal battery technology, and Murata Manufacturing Co. have entered into the first phase of an agreement to explore a collaboration for high-volume manufacturing of ceramic film for QS’s solid-state battery technology.
Mitsubishi Electric, Nanofiber Quantum Technologies Launch Trial to Develop Quantum Computer Interconnection Technology
04/25/2025 | BUSINESS WIREMitsubishi Electric Corporation and Nanofiber Quantum Technologies Inc. (NanoQT) announced today the immediate launch of a joint demonstration aimed at establishing interconnection technologies for neutral-atom quantum computers.
IQM to Deploy Poland’s First Superconducting Quantum Computer
04/25/2025 | BUSINESS WIREThe first quantum computer in Poland developed by IQM Quantum Computers, a global leader in superconducting quantum computers, will be operational at the Wrocław University of Science and Technology (WUST) in the second quarter of this year.
Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation
04/25/2025 | SiemensSiemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.
Real Time with... IPC APEX EXPO 2025: TRI Innovation—Transforming Semiconductor Inspection with AI Technology
04/25/2025 | Real Time with...IPC APEX EXPONolan Johnson talks with David Chiu, USA Sales Manager for TRI Innovation. TRI uses advanced technology to tackle challenges in inspecting tiny components. Their AI programming reduces coding time by 75%, enhancing efficiency in inspections. Collaborating with Nvidia, TRI integrates GPU technology to improve product development and encourages customers to share data for better AI performance.