Imec and Cadence Complete Tapeout of First 5nm Test Chip
October 8, 2015 | ImecEstimated reading time: 2 minutes
Nano-electronics research center imec and Cadence Design Systems, Inc. today announced that the companies completed the first tapeout of a 5nm test chip using extreme ultraviolet (EUV) as well as 193 immersion (193i) lithography. To produce this test chip, imec and Cadence optimized design rules, libraries and place-and-route technology to obtain optimal power, performance and area (PPA) scaling via Cadence® Innovus™ Implementation System. Using a processor design, imec and Cadence successfully taped out a set of designs using EUV lithography as well as Self-Aligned Quadruple Patterning (SAQP) for 193i lithography, where metal pitches were scaled from the nominal 32nm pitch down to 24nm to push the limit of patterning.
The Innovus Implementation System is a next-generation physical implementation solution that enables system-on-chip (SoC) developers to deliver designs with best-in-class PPA while accelerating time to market. Driven by a massively parallel architecture with breakthrough optimization technologies, the Innovus Implementation System provides typically 10 to 20 percent better PPA and up to 10X full-flow speedup and capacity gain.
“Our collaboration with Cadence plays an important part in the development of the world’s most advanced geometries including 5nm and below,” said An Steegen, senior vice president of Process Technology at imec. “Together, we developed the necessary technology to enable tapeouts for advanced technology nodes such as this test chip. The Cadence next-generation platform is easy to use, which helps our engineering team stay productive in developing the rule set for advanced nodes.”
“By achieving this milestone, Cadence and imec continue to demonstrate our dedication toward pushing patterning technologies to increasingly smaller nodes,” said Dr. Anirudh Devgan, senior vice president and general manager of the Digital and Signoff Group at Cadence. “With imec technology and the Cadence Innovus Implementation System, we’ve created a working flow that can pave the way for developing innovative next-generation mobile and computer advanced-node designs.”
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry.
About imec
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, USA, China, India and Japan. Its staff of about 2,200 people includes almost 700 industrial residents and guest researchers. In 2014, imec’s revenue (P&L) totaled 363 million euro.
Suggested Items
INEMI Launches Webinar on Ecological Footprint Minimization for Sustainable Electronics Roadmap
02/05/2025 | iNEMIJoin us for an insightful webinar as INEMI kicks off the development of additional content for the Sustainable Electronics Roadmap, focusing on ecological footprint minimization.
Jabil Recognizes Nordson Electronics Solutions with the 2024 Best Strategic Supplier Award
02/05/2025 | Nordson CorporationNordson Electronics Solutions, a global leader in electronics manufacturing technologies, has been honored with the 2024 Jabil Best Strategic Supplier Award, underscoring Nordson’s essential role in enabling Jabil, a global leader in manufacturing services, to achieve operational excellence and deliver exceptional value across its supply chain.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
Worldwide Semiconductor Revenue Grew 18% in 2024
02/03/2025 | Gartner, Inc.Worldwide semiconductor revenue in 2024 totaled $626 billion, an increase of 18.1% from 2024, according to preliminary results by Gartner, Inc. Revenue is projected to total $705 billion in 2025.
Transparent Electronics Market to Reach $2611 Million by 2030
01/31/2025 | BUSINESS WIREThe Global Transparent Electronics Market was valued at $963 Million in 2023 and is anticipated to reach $2611 Million by 2030, witnessing a CAGR of 15.4% during the forecast period 2024-2030.