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NPL Schedules November Webinars
November 3, 2015 | National Physical LaboratoryEstimated reading time: Less than a minute
The National Physical Laboratory's (NPL) Electronic Interconnection Group is presenting a new series of technical webinars in November.
On November 16 (14:30 UK time), Ling Zou of NPL will discuss how to avoid conductive anodic filament (CAF) failures. Apart from defining what CAF is and how failure occurs, the webinar will also talk about testing techniques and performance; failure modes; design and its impact on CAF; and the latest research work on CAF.
Dr. Chris Hunt of NPL, meanwhile, will hold a webinar on measuring coating protection performance under condensing conditions on November 26 (14:30 UK time). He will also highlight a new test being used to characterize coatings.
These webinars will run for between 45-60 min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.
For more information, click here.
Suggested Items
NPL to Hold Webinar on Reliability and Fitness for Purpose Testing of Flexible and Wearable Electronics
03/08/2018 | National Physical LaboratoryThe National Physical Laboratory (NPL) will be holding a webinar titled "Reliability and Fitness for Purpose Testing of Flexible and Wearable Electronics" on Tuesday, March 20, 2018, at 14:30 (UTC).
NPL Webinar on Reliability and Fitness for Purpose Testing of Flexible and Wearable Electronics
02/13/2018 | National Physical LaboratoryNPL will be holding a webinar on reliability and fitness for purpose testing of flexible and wearable electronics on Tuesday, March 20, 2018, at 14:30 UTC.
NPL Webinar on Characterization of High-Temp Component Interconnect Materials
12/13/2016 | National Physical LaboratoryThe UK's National Physical Laboratory (NPL) is being partnered with several end-users to better characterize alternatives for high temperature component interconnect to operate above 200°C.
Condensation Testing—A New Approach
08/02/2016 | Chris Hunt and Ling Zou, National Physical Laboratory, and Phil Kinner, Electrolube LtdWhile the characterization of coating performance under high humidity conditions is detailed in well accepted IPC and IEC standards, the performance and testing under condensing conditions is not so well developed. This article talks about a new approach that has been developed where the test board is mounted on a substrate whose temperature can be independently controlled without changing the ambient condition.
Improving Test and Inspection
07/05/2016 | Stephen Las Marias, I-Connect007In our recent survey on PCBA test and inspection challenges, respondents consider the following to be among their biggest problems: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder and other solder-related issues; finding sublayer defects; dealing with flat, no-lead components; and testing cycle time. This month, we look into different PCBA test and inspection strategies that address the key challenges in today’s electronics manufacturing and assembly environment.