Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
NPL Webinar on Characterization of High-Temp Component Interconnect Materials
December 13, 2016 | National Physical LaboratoryEstimated reading time: 1 minute
Currently, for electronic assemblies to operate at high temperature, they must use a high lead solder or expensive gold based solder. In line with this, the UK's National Physical Laboratory (NPL) is being partnered with several end-users to better characterize alternatives for high temperature component interconnect to operate above 200°C. NPL has been part of a consortia to successfully develop innovative materials specifically designed to offer a Pb-free cost-effective alternative.
In addition to this, NPL is also holding a technical webinar, with the theme Characterization of High Temperature Component Interconnect Materials, on 10 January 2017, to be presented by Martin Wickham.
This presentation summarizes the work undertaken by the authors to develop and better understand this new family of electrical interconnection materials including updated long-term reliability data. The project brought together a materials supplier (GEM - Gwent Electronic Materials), an end-user (MSL - Microsemi), and a technology research organization (NPL) to jointly develop, test and implement in production, the solution based on silver-loaded silicone materials.
This presentation focuses on the testing and materials evaluation undertaken at NPL to determine the long-term performance of these alternative materials including high temperature ageing up to 300°C, thermal cycling and damp heat testing. Details of the shear strength and electrical performance of interconnects between the substrates and components during the test regimes are given. The manufacturing process is outlined, including details of the test vehicles utilized. The processing temperature for the conductive adhesive is 250 °C, which offers additional advantages in potential improvements in component and substrate reliability compared to soldered solutions, which would typically be processed at temperatures above 300°C.
Topics covered include:
- High temperature materials and applications
- Development of materials for HT
- Reliability results from two projects
- Long-term high temperature storage and mechanical testing
- Design issues and process failures
- Future requirements and testing
This webinar will run for between 45-60 minutes, with a Q&A session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.
For more information or to register, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.