Dan’s Biz Bookshelf: ‘Innovation X: Why a Company’s Toughest Problems Are Its Greatest Advantage’
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
Fein-Lines: CES 2025—Highlighting the Future With Sony and NVIDIA
Tamara den Daas Appointed OEM Global Account Manager for Avionics & Automotive at Ventec International
November 23, 2015 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is delighted to announce the appointment of Tamara den Daas in the role of OEM Global Account Manager with a focus on opportunities within the Avionics & Automotive markets. Tamara reports to the Director of OEM Technology Marketing, Martin Cotton, joining Peter Koolen as the third member of Ventec International's OEM Group, which acts as an interface for OEM customers around the world.
With over 18 years of experience working in the PCB industry, Tamara further strengthens Ventec’s presence as a world-class provider of high performance copper clad laminates and pre-pregs. Tamara has a Bachelor of Commerce Degree and started her PCB career at Mommers Print Service which was later acquired by Viasystems. She went on to work for Square DMS, Sanmina and Elvia PCB in global Sales & Marketing roles. Tamara brings with her extensive knowledge of the PCB industry, along with an impressive network of leading contacts that she has nurtured through years of experience in the industry.
Particularly her knowledge of the Avionics and Automotive markets and her proven account management skills, enable Tamara to confidently offer Ventec’s OEM customers the right advice for the selection and specification of materials that ensure optimum product performance and cost-effectiveness without compromising manufacturability or functionality.
Martin Cotton comments: 'We are delighted that Tamara has joined our OEM Group. She knows the PCB industry inside and out, she understands materials and she knows the requirements of Avionics & Automotive OEM's. Most importantly, she also shares our vision for the future and has a clear vision for taking Ventec's business to the next level of success.'
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.
Share on:
Suggested Items
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4
01/02/2025 | I-Connect007In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.
Connect the Dots: Designing for Reality—Solder Mask and Legend
01/02/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.