-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
All About Flex: Flexible PCB: What’s in a Name?
November 25, 2015 | Dave Becker, All FlexEstimated reading time: 3 minutes
Flexible PCB is a common term that is synonymous with flexible circuits. While the term “PCB” is generally used to describe rigid printed circuitry, “flexible PCB” is a little contradictory because “boards” aren’t really flexible. Some companies, like All Flex, design and manufactures flexible PCBs, but not rigid PCBs.
There are many similarities between the two, but also significant differences.
Design
The shortest distance between two points is a straight line, so a circuit trace on a flex circuit should look like a circuit trace on a rigid circuit board, right? Actually there can be considerable differences between designing a rigid PCB and a flexible PCB. Because of the flexibility feature, there are unique issues affecting robustness. For example, since flex can bend, one needs to be sure that bending does not crack or break solders joints near a bend location. For this reason, design features like radiused corners and filleted pads are common on flexible circuits. Another issue is that the substrate used for flex is not as dimensionally stable vs. its rigid cousin. Allowances for dimensional changes may be required for flexible PCB design. Most PCB design software is tailored to rigid printed circuit materials and features. Tradeoffs occur when this same software is used to design flexible PCBs[1].
Fabrication
Rigid PCBs and flexible PCBs have very similar fabrication steps and often use the same equipment and equipment manufacturers. For example, photo imaging the base circuitry layer can use virtually identical technology. The differences arise because of the difference between handling a rigid board versus a flexible substrate. Some ultra-thin circuits are extremely flimsy and need special material handling systems. While a PCB is relatively easy to handle, a thin flexible circuit may need special clamping, fixturing or vacuum systems to hold it in place while processing. Some very high-volume flexible PCB manufactures process circuits in a continuous reel (reel-to-reel). Reel to reel processing uses significantly different material handling mechanisms vs. systems processing discrete panel sizes.
Tooling
Both PCBs and flexible PCBs use similar tooling such as CAD files, photo tools and electrical test fixtures. Perhaps the biggest difference is around the cutline definition. Flexible circuits provide unlimited configuration opportunities that often results in very odd shapes and sizes. Circuit boards often are rectangular or may have some notches or curved outlines routered. Because of this nuance, steel rule dies and hard tool dies are probably used more often for flexible PCBs than for boards, at least for ultra-high-volume applications. Laser definition of the circuit outline is also a common flex circuit process. Other differences in tooling involve fixturing that may be required to handle flexible substrates.
Coverlay/Covercoat
Flexible PCBs require different dielectric materials such as flexible photoimagable soldermask or laminated coverlay (also called coverfilm) vs. the non-flexible PCBs. This creates materials with unique properties and challenges. Materials need to bend and flex, with some applications requiring millions of cycles, without cracking or delaminating. Several design features need to be considered with dynamic flex applications, including: copper grain direction, circuit pattern layout, coverfilm thickness, and trace geometries. The most common flexible dielectric is laminated film dielectric bonded to the substrate with high temperature and pressure, a solution rarely used for rigid PCBs.
Applications
Flexible PCBs constitute about 10–15% of all PCBs produce globally, so there are far more applications that use hardboards than flex. The biggest advantage for flex is that it can reduce the size, weight and amount of hardware used for many electronic packages. It is best described as an “electronic interconnect packaging solution.” The concept of an “origami flex circuit” also comes to mind. If you have an application that requires multiple planes of interconnections, or there are active bending or flexing requirements for parts of the package, then a flexible PCB may be your best choice.
References
Dave Becker is vice president of sales and marketing at All Flex Flexible Circuits LLC.
Suggested Items
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4
01/02/2025 | I-Connect007In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.
Connect the Dots: Designing for Reality—Solder Mask and Legend
01/02/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.