-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
FlexLink to Introduce New Laser Marker with Double Sided Marking
March 1, 2016 | FlexLinkEstimated reading time: 1 minute
The latest advancement in PCB board handling by FlexLink will be introduced at the IPC APEX electronic exhibition in Las Vegas (US) on March 15. The GENIUS 1-LV is a laser marking module with inverter that is compact in size, and equipped with the world’s first 3 axis control - CO2 laser marker.
The new GENIUS 1-LV module combines the established 1-LX laser marker and the 1-IN inverter into one compact package. Its double sided marking provides permanent identification on PCBs for tracking or recognition and can mark on a variety of non-metallic surfaces. The footprint is small, and the entire module fits inside 900 x 1,600 x 1,800 mm (LxWxH).
“By integrating Keyence’s ML-Z series CO2 laser head and barrel style camera, the 1-LV provides one of the most efficient systems on the market today.” Says Dick Andersson, Product Manager Electronics at FlexLink.
“The new marker with inverter gives manufacturers the ability to reach higher production rates by allowing two operations in one, making better use of their investment. Thanks to our efficient supply chain and global footprint, customers benefit from short delivery times, excellent after sales services and fast, accurate response to their requests.” Dick Andersson concludes.
From PCB handling modules to turnkey solutions – FlexLink delivers automated production flow solutions that increase total efficiency. To find out more information about the new Genius 1-LV, please visit booth# 3114 at the IPC APEX show or contact us directly.
About FlexLink
FlexLink is a leading provider of automated production flow solutions – giving improved production efficiency to industry. Headquartered in Göteborg, Sweden, FlexLink has operating units in 30 countries and is represented in more than 60. In 2015, FlexLink had 840 employees and a turnover of SEK 1,872 million.
FlexLink is part of Coesia, an innovation based Group consisting of 14 companies specialized in automated machinery and industrial process solutions. For 2014, the Coesia Group had a turnover of Euro 1,429 million and 6,165 employees.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.