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Matrix to Display Full Line of Flexible Circuit Materials at IPC
March 3, 2016 | MatrixEstimated reading time: 1 minute
Matrix USA will be exhibiting its full line of advanced materials to support the flexible circuit market in North America.
Key products include:
PANASONIC FELIOS – Advanced adhesiveless copper clad flex materials designed to meet the demanding high performance and reliability requirements for avionic, commercial, industrial and consumer markets. Panasonic offers the largest selection of both thin and thick copper foil and polyimide film constructions in the market. Product offered in panels and rolls.
MATRIX PLUS AND PLUS FR – Full line of cover lay, bond-ply, and bond adhesives to enhance the performance of single and double sided, multilayer and rigid-flex circuit designs. Made in USA.
SANTA CLARA FLEX CONVERSION CENTER – Completed in 2015 this new flex conversion center offers quick turn conversion of roll flexible circuit materials to custom panel sizes specializing in long panel sizes such a 24” x 60”. This is supported by the region’s largest inventory of standard and specialty flex materials.
Matrix and Panasonic personnel will be available at the IPC/APEX Show in Las Vegas, March 15-17, Booth 247 to discuss the features, benefits, and advantages of these flex materials and the full line Matrix supplied materials and services.
About Matrix USA Inc.
Committed to the motto: “Quality Products, Dependable People”, Matrix was established in 1977 with the objective of providing quality raw material to the North American Printed Circuit Board Industry. Matrix has four rapid response warehouses located throughout the US and Canada that fulfil high quality, fast delivery, and custom orders daily.
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Brent Fischthal - Koh YoungSuggested Items
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10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
                                         Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production It’s Only Common Sense: Your Biggest Competitor Is Complacency
                                         It’s Only Common Sense: Your Biggest Competitor Is Complacency The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
                                         The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible





 
                     
                 
                    