Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Matrix to Display Full Line of Flexible Circuit Materials at IPC
March 3, 2016 | MatrixEstimated reading time: 1 minute
Matrix USA will be exhibiting its full line of advanced materials to support the flexible circuit market in North America.
Key products include:
PANASONIC FELIOS – Advanced adhesiveless copper clad flex materials designed to meet the demanding high performance and reliability requirements for avionic, commercial, industrial and consumer markets. Panasonic offers the largest selection of both thin and thick copper foil and polyimide film constructions in the market. Product offered in panels and rolls.
MATRIX PLUS AND PLUS FR – Full line of cover lay, bond-ply, and bond adhesives to enhance the performance of single and double sided, multilayer and rigid-flex circuit designs. Made in USA.
SANTA CLARA FLEX CONVERSION CENTER – Completed in 2015 this new flex conversion center offers quick turn conversion of roll flexible circuit materials to custom panel sizes specializing in long panel sizes such a 24” x 60”. This is supported by the region’s largest inventory of standard and specialty flex materials.
Matrix and Panasonic personnel will be available at the IPC/APEX Show in Las Vegas, March 15-17, Booth 247 to discuss the features, benefits, and advantages of these flex materials and the full line Matrix supplied materials and services.
About Matrix USA Inc.
Committed to the motto: “Quality Products, Dependable People”, Matrix was established in 1977 with the objective of providing quality raw material to the North American Printed Circuit Board Industry. Matrix has four rapid response warehouses located throughout the US and Canada that fulfil high quality, fast delivery, and custom orders daily.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.