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Real Time with… IPC APEX EXPO 2024: Precision Tools and Problem-solving With Perfect Point

05/14/2024 | Real Time with...IPC APEX EXPO
In an interview with Guest Editor Dan Beaulieu, Alex Girardot, a field applications engineer with Perfect Point, shares his experiences with precision tooling. Alex also discusses a challenging project involving thick boards and small diameter holes in which Carbonite tools with a hybrid design were used. They also discuss the trend toward smaller hole sizes.

DRAM Contract Prices for Q2 Adjusted to a 13–18% Increase

05/07/2024 | TrendForce
TrendForce’s latest forecasts reveal contract prices for DRAM in the second quarter are expected to increase by 13–18%, while NAND Flash contract prices have been adjusted to a 15–20% Only eMMC/UFS will be seeing a smaller price increase of about 10%.

Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs

05/07/2024 | Happy Holden -- Column: Happy’s Tech Talk
A significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.

It’s Only Common Sense: Would You Join Your Own Company?

05/06/2024 | Dan Beaulieu -- Column: It's Only Common Sense
In the past few years, I have heard many company runners complaining about their workforce. They tell me that the government is paying people too much money not to work, too many young people are not interested in working every day, and there is just not the work ethic there once was when they were young.

The Knowledge Base: A CM’s Perspective on Box Build Practices

04/30/2024 | Mike Konrad -- Column: The Knowledge Base
In the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
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