- 
                                  
- News
-  Books
                        Featured Books
- pcb007 Magazine
Latest IssuesCurrent Issue  The Legislative Outlook: Helping or Hurting?This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.   Advancing the Advanced Materials DiscussionMoore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.   Inventing the Future With SELTwo years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication. 
- Articles
- Columns
- Links
- Media kit||| MENU
- pcb007 Magazine
Outstanding Group of Companies and Individuals Receive FlexTech’s FLEXI Awards
March 8, 2016 | SEMIEstimated reading time: 5 minutes
FlexTech, a SEMI Strategic Association Partner, awarded five FLEXI Awards in the categories of Innovation, Research & Development, Leadership in Education, and, in a category new this year, Industry Leadership. This is the 9th year of the FLEXI Awards and the winners join a select group of companies and individuals from past years. Judging was done on a set of nominations based on a pre-described set of criteria, by a panel of non-affiliated, independent, industry experts.
This year’s Innovation Award goes to two companies, one in manufacturing and one in consumer products. The products were awarded for their outstanding design and ingenuity, with strong market adoption and significant revenue generation. The first FLEXI Award for Innovation was awarded to Sensor Films Inc. (SFI), for their Starlight Digital Manufacturing Platform, which enables a modular approach to flexible and hybrid electronic manufacturing with large area deposition of functional and decorative materials on cut-sheet, flexible, porous or rigid substrates and is scalable to roll to roll production. Peter Hessney, SFI’s president noted, We are truly grateful to be recognized by the FlexTech Alliance as the 2016 FLEXI Innovation Award winner. The award represents everything we at SFI having been working towards in bringing an additive manufacturing prototyping and production system to the emerging market of functional printing.”
Blue Spark Technologies wins the other Innovation FLEXI Award for their TempTraq® product, the only available Bluetooth, wearable temperature monitor in the form of a soft, comfortable patch that provides caregivers with continuous body temperature data for up to 24 hours to either an Apple® or Android™ compatible mobile device through the free TempTraq app. “It is an honor to be recognized by FlexTech Alliance not only for our flexible printed battery technology, but also the design and ingenuity of the application,” said John Gannon, president and chief executive officer of Blue Spark Technologies. “We are enthusiastic about the future products that will further expand on the innovative technology that powers TempTraq, which has been so widely received in the consumer space.”
Scientists at the University of Massachusetts Lowell received the FLEXI Award for Research & Development for research conducted at the Printed Electronics Research Collaborative (PERC) and the Raytheon-UMass Lowell Research Institute (RURI). This award is given to the nominee evaluated highest for the research approach, originality and the commercial potential for expanding the scope for flexible or printed electronics or manufacturing processes or a real-world problem. The PERC/RURI organization was recognized for its development of the novel BST ink, a ferroelectric nano-ink for printing electrostatically-tunable dielectrics on plastic substrates using direct-ink writing methodologies. The BST ink allows for realizing an all-printed high-frequency voltage variable capacitor for flexible, frequency-agile microwave applications such as phased array antennas and radar systems.
The Technology Leadership in Education Award was bestowed upon the National Science Foundation Center for High Rate NanoManufacturing at Northeastern University (CHN). The CHN in Boston has educated more than 130 students, half at the Ph.D. level on the topics of directed assembly-based printing, synthesis of organic semiconductor, and polymers engineering, leading to the development of the world’s first printer for nanoscale electronics on flexible or rigid substrates. CHN has had an impact on established and emerging industries in sensors, electronics, bio/medical, energy, and materials fields by educating the next generation’s professional workforce. The CHN publishes extensively in industry journals, created tutorials and other programs to educate the general public, as many as 840,000 individuals. The award recognizes outstanding contributions to the industry through education and workforce development activities. “The CHN is honored to receive the FLEXI Award for Leadership in Education,” says Ahmed Busnaina, the founding director of the Center and a professor of Mechanical Engineering. “We are proud of our many accomplishments in manufacturing and nano-scale printing such as graduating more than 130 students, more than 100 patents and developing the world’s first nanoscale 3D printer for electronics and sensors.”
Page 1 of 2
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
                                         Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production It’s Only Common Sense: Your Biggest Competitor Is Complacency
                                         It’s Only Common Sense: Your Biggest Competitor Is Complacency The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
                                         The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible





 
                     
                 
                    