Outstanding Group of Companies and Individuals Receive FlexTech’s FLEXI Awards

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2016 marks the inaugural year of the Industry Leadership Award to recognize and honor an individual who has shown particular dedication to building awareness of the capabilities and innovations which advanced flexible, hybrid and printed electronics bring to the broader field of electronics. As well, the individual has demonstrated outstanding thought leadership and vision for the industry in public forums, and association activity. The judges and FlexTech wish to acknowledge these contributions by Daniel R. Gamota, Ph.D., currently vice president of Strategic Capabilities in the Engineering & Technology Services Organization at Jabil. Dan has devoted many hours to the genesis of the industry through strategic roadmap development activities and standards work, including organizations such as IEC, IPC, iNEMI, IEEE, A*STAR, and the WTEC panel at the National Science Foundation. Dan commands thought leadership for the industry at numerous public forums and through several peer reviewed flexible and printed electronics publications. In accepting the award, Dan stated, “No one person could have much success without the cooperation of others in the emergence of a disruptive technology such as FHE. It has been a great pleasure in working with many of you in the advancement of the technology and the products they spawn.”

Also receiving awards during the evening were student poster contestants. First place was awarded to Yasmin Afsar, Levent Aygun and Can Wu from Princeton University. Their posters and research were entitled: ZnO versus a-Si thin-film oscillator circuits: metrics for design and comparison; High-Frequency ZnO Schottky Diodes for Inductive Non-Contact Interfaces for Hybrid Flexible Electronics/IC integration; and Sensor Data Compression by Large-area Electronics to Reduce Large-area to VLSI Physical Interface Connections in Hybrid Systems, respectively.

Second place poster was awarded to Francisco Suarez from North Carolina State University, for his poster entitled Flexible Thermoelectric Device Using Bulk Materials.

Third place was awarded to Yuvraj Singh from Purdue University for his work on Reliability Enhancement of Active Circuits on Flexible Substrates.

About FlexTech, a SEMI Strategic Association Partner

FlexTech is focused on growth, profitability, and success throughout the manufacturing and distribution chain of flexible, printed electronics, by developing solutions for advancing these technologies from R&D to commercialization. As a part of SEMI, FlexTech is part of an organization which connects more than 1,900 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. Members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped our members grow more profitably, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.

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