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Breaking High-speed Material Constraints: Design007 Magazine — May 2024

05/14/2024 | I-Connect007 Editorial Team
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems instead of high-speed materials, saving time and money while streamlining the fab process. In the May 2024 issue of Design007 Magazine, our contributors explain how to avoid overconstraining your materials when working with high-speed boards.

DuPont Unveils Pyralux ML Laminate Series, Offering High Thermal Management for Extreme Environments

04/09/2024 | DuPont
DuPont introduced the DuPont™ Pyralux® ML Series of double-sided metal-clad laminates, a unique addition to its extensive family of Pyralux® laminates for flexible and rigid-flex printed circuit boards (PCBs).

Arlon EMD and EMC Announce Expansion in California

03/25/2024 | Arlon EMD
Arlon EMD, a division of Elite Materials Company (EMC), announces a factory expansion at the Rancho Cucamonga, CA location.   Arlon is a global leader in high performance thermoset substrates for mission critical printed circuit boards manufactured for high endurance and long-life programs. Arlon has a 45-year history of manufacturing specialty materials for the Aerospace, Industrial and Military (AIM) markets.

EMC, Arlon Industry Leading PWB Laminates at DesignCon 2024

01/29/2024 | EMC
At the DesignCon 2024 Expo, drop by EMC/ Arlon booth #1260 and learn from the experts with the results from a wide range of performance testing that some of our key OEM customers in almost all market segments of technology, have completed. 

Designers Notebook: What Designers Need to Know About Manufacturing, Part 1

01/25/2024 | Vern Solberg -- Column: Designer's Notebook
The designer needs to have a working understanding of two key manufacturing operations: basic circuit board fabrication procedures and assembly process practices. For printed circuit board manufacturing, the number of steps required to produce the printed circuit board correlates to the circuit board's complexity. Greater process complexity in fabricating the circuit board equates to increased costs. To develop any portion of the electronic product, the designer must apply the design for manufacturing (DFM) principles established in the industry. In fact, DFM should always be the goal of the design engineer. It encompasses a wide range of disciplines that must be considered during the planning phase of any product.
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