-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
ACE Receives NPI Award for its JEDEC Tray-to-Tray Lead Tinning System
March 31, 2016 | ACE Production Technologies Inc.Estimated reading time: 2 minutes
ACE Production Technologies, Inc., a leading supplier of selective soldering systems, lead tinning systems and lead tinning services is pleased to announce that it has been awarded a 2016 NPI Award in the category of soldering equipment for its LTS300-JEDEC tray-to-tray lead tinning system.
The LTS300-JEDEC is the most technologically advanced molten solder lead tinning system on the market consisting of two dynamic nitrogen inerted solder pots, a dynamic flat wave fluxing station, forced convection preheating, aqueous wash and drying stations, plus a JEDEC tray stacker forming a complete work cell.
At the heart of the new LTS300-JEDEC is a fully integrated vision system consisting of top and bottom viewing cameras for accurate alignment of electronic components prior to re-tinning to ensure complete control over fine-pitch components during immersion and extraction of the hot solder dip process. The vision system also performs post-tinning inspection to detect potential solder bridges before placing components back into a JEDEC tray. The LTS300-JEDEC is a fully-configured system capable of performing a molten solder component lead tinning process for gold removal and re-tinning of components for Class 2 and Class 3 applications in compliance with the new J-STD-001, Rev F requirements.
The dual solder pot machine architecture of the LTS300-JEDEC allows for component re-tinning in accordance with GEIA-STD-0006 requirements to enhance component solderability. The LTS300-JEDEC is capable of re-tinning leaded fine-pitch components such as QFPs as small as 6mm x 6mm or as large as 50mm x 50mm with a lead pitch down to 0.012” with bridge free results. In addition, bottom terminated components such as QFNs and DFNs as small as 3mm x 3mm and with a lead pitch down to 0.5mm can be re-tinned all the while maintaining world-class coplanarity within 0.003” for these leadless devices.
Sponsored by Circuits Assembly, the NPI Award program recognizes the electronics assembly industry’s leading new products and is an annual celebration of product excellence within the electronics assembly industry. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
About ACE
ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services. For more information, click here, call 509-924-4898 or email sales@ace-protech.com.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.