-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
ESI Advances HDI Via Drilling Solutions Portfolio in APAC
May 3, 2016 | Globe NewswireEstimated reading time: 2 minutes
Electro Scientific Industries Inc. has announced that its nViant laser processing system has secured multiple customer placements in the high density interconnect (HDI) and substrate processing segments.
With global smartphone sales expected to grow by only seven percent in 2016 (Gartner), component manufacturers are under increasing market pressure to deliver advanced technology on smaller form factors, at reduced production costs. The placement of nViant systems demonstrates the Asian electronics manufacturing community's increasing acceptance of the superior manufacturing capabilities and greater flexibility that laser-based tools deliver.
"We are beginning to gain traction in the HDI and substrate manufacturing segments," said Dr. Michael Darwin, Vice President and General Manager of ESI's Component Processing Division. "These placements show good progress on our strategy to expand ESI's via drilling portfolio in the printed circuit board and substrate markets."
Demand in the smartphone and IoT markets is driving the need for miniaturization, while maintaining or increasing device functionality, all at the lowest possible cost. In order to take advantage of such trends, manufacturers are increasingly utilizing laser-based machining to either reduce the size of -- or increase the density of -- relevant features such as HDI microvias. The nViant system possesses the accuracy and throughput required to meet these new market needs, while doing so at the lowest possible cost of ownership as compared to other like equipment. As orders for emerging technologies increase, manufacturers with laser-based micromachining capabilities will be better equipped to address complex engineering and design specifications dictated by such product requirements as being bendable, stretchable, and reliable and accommodating a higher level of component density. A system like nViant is necessary to deliver circuitry that works within these evolving constraints, while also serving the immediate PCB and substrate processing requirements for today.
"nViant helps customers optimize their manufacturing capabilities to create interconnected solutions and deliver the next generation of circuitry," said Dr. Darwin. ESI remains deeply committed to its customers' success by providing direct engineering field support to drive continuous improvement and rapid technology advancement. Despite global market pressures and fierce competition, the company and Darwin are optimistic that these placements represent pivotal opportunities to demonstrate ESI's strength as an innovation partner in the APAC region.
About ESI
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in Portland, Oregon, with global operations from the Pacific Northwest to the Pacific Rim. More information is available at www.esi.com.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
05/03/2024 | PRNewswireSynopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/03/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Real Time with… IPC APEX EXPO 2024: Software Solutions for Circuit Board Challenges
05/03/2024 | Real Time with...IPC APEX EXPONolan Johnson speaks with Will Webb from Aster Technologies about their software solutions for design teams, manufacturing, test engineers, and process engineers. Aster's software addresses the increasing complexities of circuit boards and the need for alternative testing methods.
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.